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مجله مواد الکترونیکی 2013
جزئیات رویداد
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  • effect of ag on the microstructure of sn-8.5zn-xag-0.01al-0.1ga solders under high-temperature and high-humidity conditions

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    • تاریخ ارائه: 1392/07/24
    • تاریخ انتشار در تی پی بین: 1392/07/24
    • تعداد بازدید: 961
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    • شماره تماس دبیرخانه رویداد: -
     the effect of ag on the microstructure and thermal behavior of sn-zn and sn-8.5zn-xag-0.01al-0.1ga solders (x from 0.1 wt.% to 1 wt.%) under high-temperature/relative humidity conditions (85°c/85% rh) for various exposure times was investigated. scanning electron microscopy (sem) studies revealed that, in all the investigated solders, the primary α-zn phases were surrounded by eutectic β-sn/α-zn phases, in which fine zn platelets were dispersed in the β-sn matrix. sem micrographs revealed that increase of the ag content to 1 wt.% resulted in coarsening of the dendritic plates and diminished the sn-9zn eutectic phase in the microstructure. differential scanning calorimetry (dsc) studies revealed that the melting temperature of sn-8.5zn-xag-0.01al-0.1ga solder decreased from 199.6°c to 199.2°c with increase of the ag content in the solder alloy. both zno and sno2 along with ag-zn intermetallic compound (imc) were formed on the surface when sn-8.5zn-0.5ag-0.01al-0.1ga solder was exposed to high-temperature/high-humidity conditions (85°c/85% rh) for 100 h. the thickness of the zno phase increased as the ag content and exposure time were increased. sn whiskers of various shapes and lengths varying from 2 μm to 5 μm were extruded from the surface when the investigated five-element solder with ag content varying from 0.5 wt.% to 1 wt.% was exposed to similar temperature/humidity conditions for 250 h. the length and density of the whiskers increased with further increase of the exposure time to 500 h and the ag content in the solder to 1 wt.%. the sn whisker growth was driven by the compressive stress in the solder, which was generated due to the volume expansion caused by zno and ag-zn intermetallic compound formation at the grain boundaries of sn.

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