مقاله Copper Wire Bonding Concerns and Best Practices : تی پی بین

خلاصه مقاله

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been implementing. The paper also provides information to enable customers to conduct qualification and reliability tests on microelectronic packages to facilitate adoption in their target applications.

نویسندگان

Preeti Chauhan [ CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD, 20742, USA ]

Z. W. Zhong [ School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore ]

Michael Pecht [ CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD, 20742, USA ]

کلمات کلیدی

Wire bonding copper gold oxidation corrosion humidity

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مشاهده مقالات

Journal of Electronic Materials 2013

The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.

حوزه های تحت پوشش : nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications