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نویسندگان مقالات پربازدید :
مجله مواد الکترونیکی 2013
جزئیات رویداد
همایش ، رویداد ، ژورنال
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  • impact of thermal aging on the microstructure evolution and mechanical properties of lanthanum-doped tin-silver-copper lead-free solders

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    • تاریخ ارائه: 1392/07/24
    • تاریخ انتشار در تی پی بین: 1392/07/24
    • تعداد بازدید: 985
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    • شماره تماس دبیرخانه رویداد: -
     an extensive study is made to analyze the impact of pure lanthanum on the microstructure and mechanical properties of sn-ag-cu (sac) alloys at high temperatures. different compositions are tested; the temperature applied for the isothermal aging is 150°c, and aging times of 10 h, 25 h, 50 h, 100 h, and 200 h are studied. optical microscopy with cross-polarized light is used to follow the grain size, which is refined from 8 mm to 1 mm for as-cast samples and is maintained during thermal aging. intermetallic compounds (imcs) present inside the bulk sn matrix affect the mechanical properties of the sac alloys. due to high-temperature exposure, these imcs grow and hence their impact on mechanical properties becomes more significant. this growth is followed by scanning electron microscopy, and energy-dispersive spectroscopy is used for elemental mapping of each phase. a significant refinement in the average size of imcs of up to 40% is identified for the as-cast samples, and the coarsening rate of these imcs is slowed by up to 70% with no change in the interparticle spacing. yield stress and tensile strength are determined through tensile testing at 20°c for as-cast samples and after thermal aging at 150°c for 100 h and 200 h. both yield stress and tensile strength are increased by up to 20% by minute lanthanum doping.

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