• depth profiling of electronic transport parameters in n-on-p boron-ion-implanted vacancy-doped hgcdte

    جزئیات بیشتر مقاله
    • تاریخ ارائه: 1392/07/24
    • تاریخ انتشار در تی پی بین: 1392/07/24
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     we report results of a detailed study of electronic transport in n-on-p junctions formed by 150-kev boron-ion implantation in vacancy-doped p-type hg0.769cd0.231te without postimplantation thermal annealing. a mobility spectrum analysis methodology in conjunction with a wet chemical etching-based surface removal approach has been employed to depth profile the transport characteristics of the samples. in the as-implanted samples, three distinct electron species were detected which are shown to be associated with (a) low-mobility electrons in the top 220-nm surface-damaged layer (e1μ 80k = 2940 cm2/vs), (b) the b-ion implantation region in the top 500-nm region (e 2μ80k = 7490 cm2/vs), and (c) high-mobility electrons in the n-to-p transition region at a depth of 600 nm to 700 nm (e 3μ 80k = 25,640 cm2/vs). due to the maximum magnetic field employed (2 t), hole carriers from the underlying vacancy-doped p-type region were detected only after the removal of the top 220 nm of the profiled sample (μ 80k = 126 cm2/vs), revealing fully p-type character 800 nm below the original sample surface. a comparison of the extracted e 2 electron concentration and calculated b-impurity profile suggests that the n-type region is due primarily to near-surface implantation-induced lattice damage.

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