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مواد و طراحی
جزئیات رویداد
همایش ، رویداد ، ژورنال
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  • the effect of cooling rate on the dendritic spacing and morphology of ag3sn intermetallic particles of a snag solder alloy

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    • تاریخ ارائه: 1390/01/01
    • تاریخ انتشار در تی پی بین: 1390/01/01
    • تعداد بازدید: 582
    • تعداد پرسش و پاسخ ها: 0
    • شماره تماس دبیرخانه رویداد: -
     the size and morphology of intermetallic compounds of sn–ag solder alloys can have a significant influence on the mechanical strength of solder joints. the aim of the present study is to characterize the as-cast microstructure of a sn–2 wt.% ag solder alloy, and to correlate the resulting scale of the dendritic matrix and the morphology of the ag3sn intermetallic compound (imc) with the corresponding solidification cooling rate. pre-heated low-carbon steel molds and a water-cooled solidification apparatus were used permitting a significant range of solidification cooling rates to be experimentally examined. it is shown that under very slow cooling conditions (0.02 °c/s) the microstructure of the sample is formed by a coarse dendritic matrix and a mixture of fiber and plate-like ag3sn imc in the interdendritic region with the fibers located along the board line separating the matrix. for cooling rates from 0.15 to 1.15 °c/s a mixture of spheroid and fiber-like imc and secondary dendrite arm spacings between 15 and 40 μm, with the spheroids located in the center of the interdendritic region. at higher cooling rates, of about 8 °c/s only ag3sn spheroids (of about 0.5 μm in diameter) prevail in the eutectic mixture.

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