mechanical phenomena of a new-type anisotropic conductive film adhering to the outer lead bonding

in this study the adhesive strength and swelling effect of a new-type anisotropic conductive film (acf) adhering to the outer lead bonding (olb) are investigated by experiments. the new-type acf offers lower bonding temperature and less curing time than the conventional-type acf in manufacturing processes. for further investigating the mechanical behaviors of this new-type acf, the finite element analysis is used to assess the states of both adhesion and pressured conductive particle in detail. it can be found that the delamination occurs on the interface between acf and glass substrate and it can cause the distribution of indium tin oxides (itos) pattern on the glass substrate which would affect the growing path of delamination in particular. then the range of the temperature cycling between −40 °c and 125 °c is used to estimate the elastic-plastic behaviors of au-coating conductive particles at different positions.