اینستاگرام تی پی بین
همایش ، رویداد ، ژورنال
حوزه های تحت پوشش رویداد
  • impact of interface microstructure on adhesion force between silver paste and silicon solar cells’ emitter

    جزئیات بیشتر مقاله
    • تاریخ ارائه: 1392/07/24
    • تاریخ انتشار در تی پی بین: 1392/07/24
    • تعداد بازدید: 1000
    • تعداد پرسش و پاسخ ها: 0
    • شماره تماس دبیرخانه رویداد: -
     the adhesion strength between silver paste and silicon solar cell’s emitter is a primary source of long-term degradation in solar modules. in this study, the interface microstructure between screen-printed silver thick-film and silicon solar cells’ emitter was studied. three kinds of commercial silver pastes were printed on silicon solar cells’ emitter to form different ag–si contact structures. the interface microstructure between silver paste and emitter was observed by sem, while the compositions of ag thick-film were analyzed by edx. the deductions we got from sem and edx were verified by the pull test for the first time. the results presented in this study give some suggestions to the development of silver paste and crystalline silicon solar cells’ fire-through.

سوال خود را در مورد این مقاله مطرح نمایید :

با انتخاب دکمه ثبت پرسش، موافقت خود را با قوانین انتشار محتوا در وبسایت تی پی بین اعلام می کنم
مقالات جدیدترین رویدادها
مقالات جدیدترین ژورنال ها