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مجله مواد الکترونیکی 2013
جزئیات رویداد
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  • a study on the physical properties and interfacial reactions with cu substrate of rapidly solidified sn-3.5ag lead-free solder

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    • تاریخ ارائه: 1392/07/24
    • تاریخ انتشار در تی پی بین: 1392/07/24
    • تعداد بازدید: 978
    • تعداد پرسش و پاسخ ها: 0
    • شماره تماس دبیرخانه رویداد: -
     a rapidly solidified sn-3.5ag eutectic alloy produced by the melt-spinning technique was used as a sample in this research to investigate the microstructure, thermal properties, solder wettability, and inhibitory effect of ag3sn on cu6sn5 intermetallic compound (imc). in addition, an as-cast sn-3.5ag solder was prepared as a reference. rapidly solidified and as-cast sn-3.5ag alloys of the same size were soldered at 250°c for 1 s to observe their instant melting characteristics and for 3 s with different cooling methods to study the inhibitory effect of ag3sn on cu6sn5 imc. experimental techniques such as scanning electron microscopy, differential scanning calorimetry, and energy-dispersive spectrometry were used to observe and analyze the results of the study. it was found that rapidly solidified sn-3.5ag solder has more uniform microstructure, better wettability, and higher melting rate as compared with the as-cast material; ag3sn nanoparticles that formed in the rapidly solidified sn-3.5ag solder inhibited the growth of cu6sn5 imc during aging significantly much strongly than in the as-cast material because their number in the rapidly solidified sn-3.5ag solder was greater than in the as-cast material with the same soldering process before aging. among the various alternative lead-free solders, this study focused on comparison between rapidly solidified and as-cast solder alloys, with the former being observed to have better properties.

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